Paper Co-authored by Prof. Mansun CHAN Received the Best Paper Award from The 15th IEEE International Conference on Electron Devices and Solid-State Circuits

The paper, "Modeling the Heating Effects in PCM for Circuit Simulation Accelerations", that co-authored by Prof Mansun CHAN received the Best Paper Award from the 15th IEEE International Conference on Electron Devices and Solid-State Circuits in June 2019.

 

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